Samsung DDR3 Uživatelský manuál stáhnout pdf (Strana 3)

General Information

DDR3 SDRAM

2. DDR3 SDRAM Component Product Guide

Density Banks Part Number

Package & Power,

Temp. (-C/-L) & Speed

Org. VDD Voltage PKG Avail. Note

K4B1G0446D HC(L)F7/F8/H9 256M x 4

78 + 4 ball

1Gb D-die 8Banks

K4B1G0846D HC(L)F7/F8/H9 128M x 8

1.5V

FBGA

Now

K4B1G1646D HC(L)F7/F8/H9 64M x 16

96 + 4 ball

FBGA

K4B1G0446E HC(L)F7/F8/H9/K0 256M x 4

78 ball

K4B1G0846E HC(L)F7/F8/H9/K0 128M x 8

1.5V

FBGA

1Gb E-die 8Banks K4B1G1646E HC(L)F7/F8/H9/K0 64M x 16

96 ball

FBGA

Now

K4B1G0446E HYF7/F8/H9/K0 256M x 4

1.35V

78 ball

K4B1G0846E HYF7/F8/H9/K0 128M x 8

FBGA

K4B1G0446F HC(L)F8/H9 256M x 4

1.5V

1Gb F-die 8Banks

K4B1G0846F HC(L)F8/H9 128M x 8

78 ball

Now

K4B1G0446F HY(L)F8/H9 256M x 4

1.35V

FBGA

K4B1G0846F HY(L)F8/H9 128M x 8

K4B2G0446B HC(L)F7/F8/H9 512M x 4

78 ball

K4B2G0846B HC(L)F7/F8/H9 256M x 8

1.5V

FBGA

2Gb B-die 8Banks K4B2G1646B HC(L)F7/F8/H9 128M x 16

96 ball

FBGA

Now

K4B2G0446B HYF7/F8/H9 512M x 4

1.35V

78 ball

K4B2G0846B HYF7/F8/H9 256M x 8

FBGA

K4B2G0446C HC(L)F8/H9 512M x 4

1.5V

2Gb C-die 8Banks

K4B2G0846C HC(L)F8/H9 256M x 8

78 ball

Now

K4B2G0446C HY(L)F8/H9 512M x 4

1.35V

FBGA

K4B2G0846C HY(L)F8/H9 256M x 8

DDP 2Gb D-die 8Banks

K4B2G0446D MC(L)F7/F8/H9 512M x 4

1.5V

78 ball

Now

K4B2G0846D MC(L)F7/F8/H9 256M x 8

FBGA

DDP 2Gb E-die 8Banks

K4B2G0446E MC(L)F7/F8/H9 512M x 4

1.5V

78 ball

Now

K4B2G0846E MC(L)F7/F8/H9 256M x 8

FBGA

DDP 4Gb B-die 8Banks

K4B4G0446B MC(L)F7/F8/H9 1G x 4

1.5V

78 ball

Now

K4B2G0846B MC(L)F7/F8/H9 512M x 8

FBGA

Note : 1.35V product is 1.5V operatable.

ELECTRONICS

October 2009

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