
General Information
DDR3 SDRAM
78 + 4Ball FBGA for 1Gb D-die (x4/x8)
(Datum A)
9.00 ± 0.10
82 -
0
0.45 Solder ball
(Post Reflow
0
0.05 ± 0.05)
№-|0 0.2 (MIa|b|
o : Support Ball
MOLDING AREA
(1.90)
Bottom
Top
96 + 4Ball FBGA for 1Gb D-die (x16)
Bottom
Top
o : Support Ball
October 2009
ELECTRONICS
Komentáře k této Příručce